View 74LVCH16244A_202867.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
74LVC16244A; 74LVCH16244A 16-bit buffer/line driver; 5 V input/output tolerant (3-state)
Product specification Supersedes data of 2002 Oct 30 2003 Jan 30
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
FEATURES * 5 V tolerant inputs/outputs for interfacing with 5 V logic * Wide supply voltage range from 1.2 to 3.6 V * CMOS low power consumption * MULTIBYTETM flow-through standard pin-out architecture * Low inductance multiple power and ground pins for minimum noise and ground bounce * Direct interface with TTL levels * All data inputs have bushold (74LVCH16244A only). * Complies with JEDEC standard no. 8-1A * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. DESCRIPTION
74LVC16244A; 74LVCH16244A
The 74LVC(H)16244A is a high-performance, low power, low voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 Volt. These features allow the use of these devices as a mixed 3.3 and 5 V environment. The 74LVC(H)16244A is a 16-bit non-inverting buffer/line driver with 3-state outputs. The device can be used as four 4-bit buffers, two 8-bit buffers or one 16-bit buffer. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. The 74LVC(H)16244A is identical to the 74LVC16240A but has non-inverting outputs. The 74LVCH16244A bushold data inputs eliminates the need for external pull-up resistors to hold unused inputs.
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH CI CPD Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of the outputs. PARAMETER propagation delay nAn to nYn input capacitance power dissipation capacitance per gate VI = GND to VCC; note 1 CONDITIONS CL = 50 pF; VCC = 3.3 V TYPICAL 3.0 5.0 25 ns pF pF UNIT
2003 Jan 30
2
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
ORDERING INFORMATION PACKAGE TYPE NUMBER 74LVC16244ADL 74LVCH16244ADL 74LVC16244ADGG 74LVCH16244ADGG 74LVC16244AEV 74LVCH16244AEV FUNCTION TABLE See note 1. INPUT nOE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. nAn L H X TEMPERATURE RANGE -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C PINS 48 48 48 48 56 56
74LVC16244A; 74LVCH16244A
PACKAGE MATERIAL SSOP48 SSOP48 TSSOP48 TSSOP48 VFBGA56 VFBGA56 plastic plastic plastic plastic plastic plastic
CODE SOT370-1 SOT370-1 SOT362-1 SOT362-1 SOT702-1 SOT702-1
OUTPUT nYn L H Z
2003 Jan 30
3
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
PINNING SYMBOL 1OE n.c. 1Y0 1Y1 GND 1Y2 1Y3 VCC 2Y0 2Y1 2Y2 2Y3 3Y0 3Y1 3Y2 3Y3 4Y0 4Y1 4Y2 4Y3 4OE 3OE 4A3 4A2 4A1 4A0 3A3 3A2 3A1 3A0 2A3 2A2 2A1 2A0 1A3 1A2 1A1 1A0 2OE 2003 Jan 30 PINS 1 - 2 3 4, 10, 15, 21, 28, 34, 39, 45 5 6 7, 18, 31, 42 8 9 11 12 13 14 16 17 19 20 22 23 24 25 26 27 29 30 32 33 35 36 37 38 40 41 43 44 46 47 48 BALLS A1 A2, A3, A4, A5, E3, E4, F3, F4, K2, K3, K4, K5 B2 B1 C2 C1 C3, H3, C4, H4 D2 D1 E2 E1 F1 F2 G1 G2 H1 H2 J1 J2 K1 K6 J5 J6 H5 H6 G5 G6 F5 F6 D6 E5 D6 D5 C6 C5 B6 B5 A6 4
74LVC16244A; 74LVCH16244A
DESCRIPTION output enable input (active LOW) not connected data output data output data output data output supply voltage data output data output data output data output data output data output data output data output data output data output data output data output output enable input (active LOW) output enable input (active LOW) data input data input data input data input data input data input data input data input data input data input data input data input data input data input data input data input output enable input (active LOW)
B3, B4, D3, D4, G3, G4, J3, J4 ground (0 V)
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
handbook, halfpage
1OE 1 1Y0 1Y1 GND 1Y2 1Y3 VCC 2Y0 2Y1 2 3 4 5 6 7 8 9
48 2OE 47 1A0 46 1A1 45 GND 44 1A2 43 1A3 42 VCC 41 2A0 40 2A1 39 GND 38 2A2 37 2A3 E 2Y3 3Y0 3Y2 4Y0 4Y2 4OE 1 2 3 4 5 2Y2 3Y1 3Y3 4Y1 4Y3 GND GND 2A2 3A1 3A3 4A1 4A3 2A3 3A0 3A2 4A0 4A2 3OE 6
MNA702
A
1OE
2OE
B
1Y1 1Y3 2Y1
1Y0 1Y2 2Y0
GND
GND
1A0 1A2 2A0
1A1 1A3 2A1
C
VCC GND
VCC GND
GND 10 2Y2 11 2Y3 12 3Y0 13 3Y1 14 GND 15 3Y2 16 3Y3 17 VCC 18 4Y0 19 4Y1 20 GND 21 4Y2 22 4Y3 23 4OE 24
MNA706
D
16244
36 3A0 35 3A1 34 GND 33 3A2 32 3A3 31 VCC 30 4A0 29 4A1 28 GND 27 4A2 26 4A3 25 3OE
F
G
H
VCC GND
VCC GND
J
K
Fig.1 Pin configuration SSOP/TSSOP48.
Fig.2 Pin configuration VFBGA56.
2003 Jan 30
5
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
handbook, full pagewidth
1A0
47
2
1Y0
3A0
36
13
3Y0
1A1
46
3
1Y1
3A1
35
14
3Y1
1A2
44
5
1Y2
3A2
33
16
3Y2
1A3
43
6
1Y3
3A3
32
17
3Y3
1OE
1
3OE
25
2A0
41
8
2Y0
4A0
30
19
4Y0
2A1
40
9
2Y1
4A1
29
20
4Y1
2A2
38
11
2Y2
4A2
27
22
4Y2
2A3
37
12
2Y3
4A3
26
23
4Y3
2OE
48
4OE
24
MNA703
Fig.3 Logic symbol.
2003 Jan 30
6
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
handbook, halfpage
1OE 2OE 3OE 4OE 1A0 1A1 1A2 1A3 2A0 2A1 2A2 2A3 3A0 3A1 3A2 3A3 4A0 4A1 4A2 4A3
1 48 25 24 47 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26
1EN 2EN 3EN 4EN 1 1 2 3 5 6 12 8 9 11 12 13 13 14 16 17 14 19 20 22 23
MNA704
1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 3Y0 3Y1 3Y2 3Y3 4Y0 4Y1 4Y2 4Y3
MNA705
handbook, halfpage
VCC
data input
to internal circuit
Fig.4 Logic symbol (IEEE/IEC).
Fig.5 Bushold circuit.
2003 Jan 30
7
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times output HIGH or LOW state output 3-state in free air VCC = 1.2 to 2.7 V VCC = 2.7 to 3.6 V CONDITIONS for low voltage applications
74LVC16244A; 74LVCH16244A
MIN. 1.2 0 0 0 -40 0 0
MAX. 3.6 3.6 5.5 VCC 5.5 +85 20 10
UNIT V V V V V C ns/V ns/V
for maximum speed performance 2.7
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO PARAMETER supply voltage input diode current input voltage output diode current output voltage VI < 0 note 1 VO > VCC or VO < 0 output HIGH or LOW state; note 1 output 3-state; note 1 IO ICC, IGND Tstg Ptot output source or sink current VCC or GND current storage temperature power dissipation; SSOP and TSSOP package VFBGA package Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 60 C the value of PD derates linearly with 5.5 mW/K. 3. Above 70 C the value of PD derates linearly with 1.8 mW/K. temperature range from -40 to +85 C; note 2 temperature range from -40 to +85 C; note 3 - - 500 1000 mW mW VO = 0 to VCC CONDITIONS - -0.5 - -0.5 -0.5 - - -65 MIN. -0.5 MAX. +6.5 -50 +6.5 50 VCC + 0.5 +6.5 50 100 +150 UNIT V mA V mA V V mA mA C
2003 Jan 30
8
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
DC CHARACTERISTICS At recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +85 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = -12 mA IO = -100 A IO = -18 mA IO = -24 mA VOL LOW-level output voltage VI = VIH or VIL IO = 12 mA IO = 100 A IO = 24 mA II IOZ Ioff ICC ICC IBHL IBHH IBHLO IBHHO Notes 1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C. input leakage current 3-state output OFF-state current power off leakage supply quiescent supply current VI = 5.5 V or GND; note 2 VI = VIH or VIL; VO = 5.5 V or GND VI or VO = 5.5 V VI = VCC or GND; IO = 0 2.7 3.0 3.0 3.6 3.6 0.0 3.6 - - - - - - - 2.7 3.0 3.0 3.0 1.2 1.2 VCC - VCC (V) MIN.
74LVC16244A; 74LVCH16244A
TYP.(1)
MAX.
UNIT
- - - -
- - GND 0.8 - - - - 0.40 0.20 0.55 5 5 10 20 500 - - - -
V V V V V V V V V V V A A A A A A A A A
2.7 to 3.6 2.0 2.7 to 3.6 -
VCC - 0.5 - VCC - 0.2 VCC VCC - 0.6 - VCC - 0.8 - - - - 0.1 0.1 0.1 0.1 5 - - - -
additional quiescent supply VI = VCC-0.6V; IO = 0 current per pin bushold LOW sustaining current bushold HIGH sustaining current bushold LOW overdrive current bushold HIGH overdrive current
2.7 to 3.6 - 75 -75 500 -500
VI = 0.8 V; notes 3, 4 and 5 3.0 VI = 2.0 V; notes 3, 4 and 5 3.0 notes 3, 4 and 6 notes 3, 4 and 6 3.6 3.6
2. For bushold parts, the bushold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal. 3. Valid for data inputs of bushold parts (74LVCH16244A) only. 4. For data inputs only, control inputs do not have a bushold circuit. 5. The specified sustaining current at the data input holds the input below the specified VI level. 6. The specified overdrive current at the data input forces the data input to the opposite input state.
2003 Jan 30
9
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns. CONDITIONS SYMBOL Tamb = -40 to +85 C tPHL/tPLH propagation delay nAn to nYn see Figs 6 and 8 1.2 2.7 3.0 to 3.6 tPZH/tPZL 3-state output enable time nOE to nYn see Figs 7 and 8 1.2 2.7 3.0 to 3.6 tPHZ/tPLZ 3-state output disable time nOE to nYn see Figs 7 and 8 1.2 2.7 3.0 to 3.6 Note 1. Typical values are measured at VCC = 3.3 V and Tamb = 25 C. AC WAVEFORMS - 1.5 1.5 - 1.5 1.5 - 1.5 1.5 PARAMETER WAVEFORMS VCC (V) MIN.
74LVC16244A; 74LVCH16244A
TYP.
MAX.
UNIT
11.0 - 3.0(1) 15.0 - 3.5(1) 10.0 - 3.7(1)
- 5.5 4.5 - 6.5 5.5 - 6.2 5.2
ns ns ns ns ns ns ns ns ns
handbook, halfpage VI
nAn input GND tPLH VOH nYn output VOL
VM
VM
tPHL
VM
VM
MNA171
INPUT VCC 1.2 V 2.7 V 3.0 to 3.6 V VM 0.5 x VCC 1.5 V 1.5 V VCC 2.7 V 2.7 V VI tr = tf 2.5 ns 2.5 ns 2.5 ns
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 The input nAn to output nYn propagation delays.
2003 Jan 30
10
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
handbook, full pagewidth
VI nOE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
MNA362
INPUT VCC 1.2 V 2.7 V 3.0 to 3.6 V VM 0.5 x VCC 1.5 V 1.5 V VCC 2.7 V 2.7 V VI tr = tf 2.5 ns 2.5 ns 2.5 ns
VX = VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V at VCC < 2.7 V; VY = VOH - 0.3 V at VCC 2.7 V; VY = VOH - 0.1 V at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.7 3-state enable and disable times.
2003 Jan 30
11
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
handbook, full pagewidth
VEXT VCC PULSE GENERATOR VI D.U.T. RT CL RL VO RL
MNA616
VCC 1.2 V 2.7 V 3.0 to 3.6 V
VI VCC 2.7 V 2.7 V
CL 50 pF 50 pF 50 pF
RL 500 500 500
VEXT tPLH/tPHL tPZH/tPHZ open open open GND GND GND tPZL/tPLZ 2 x VCC 2 x VCC 2 x VCC
Definitions for test circuits: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2003 Jan 30
12
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
PACKAGE OUTLINES SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
74LVC16244A; 74LVCH16244A
SOT370-1
D
E
A X
c y HE vM A
Z 48 25
Q A2 A1 (A 3) Lp 1 bp 24 wM L detail X A
pin 1 index
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.8 A1 0.4 0.2 A2 2.35 2.20 A3 0.25 bp 0.3 0.2 c 0.22 0.13 D (1) 16.00 15.75 E (1) 7.6 7.4 e 0.635 HE 10.4 10.1 L 1.4 Lp 1.0 0.6 Q 1.2 1.0 v 0.25 w 0.18 y 0.1 Z (1) 0.85 0.40 8 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 REFERENCES IEC JEDEC MO-118 EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 99-12-27
2003 Jan 30
13
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
E
A X
c y HE vMA
Z
48
25
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp
24
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 12.6 12.4 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.8 0.4 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-10 99-12-27
2003 Jan 30
14
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
74LVC16244A; 74LVCH16244A
VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm
SOT702-1
D
B
A
ball A1 index area
E
A
A2 A1
detail X
e1 e
1/2 e
b
v M C A B w M C
C y1 C y
K J H e G F E D C B A ball A1 index area
1/2 e
e2
X
1
2
3
4
5
6
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.3 0.2 A2 0.7 0.6 b 0.45 0.35 D 4.6 4.4 E 7.1 6.9 e 0.65 e1 3.25 e2 5.85 v 0.15 w 0.08 y 0.08 y1 0.1 0 2.5 scale 5 mm
OUTLINE VERSION SOT702-1
REFERENCES IEC JEDEC MO-225 JEITA
EUROPEAN PROJECTION
ISSUE DATE 01-06-25 02-08-08
2003 Jan 30
15
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74LVC16244A; 74LVCH16244A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2003 Jan 30
16
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3)
74LVC16244A; 74LVCH16244A
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 Jan 30
17
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
74LVC16244A; 74LVCH16244A
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Jan 30
18
Philips Semiconductors
Product specification
16-bit buffer/line driver; 5 V input/output tolerant (3-state)
NOTES
74LVC16244A; 74LVCH16244A
2003 Jan 30
19
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/06/pp20
Date of release: 2003
Jan 30
Document order number:
9397 750 10748

▲Up To Search▲

Price & Availability of 74LVCH16244A

	To Download 74LVCH16244A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .